The **ATS-04H-124-C2-R0** is a high-performance heat sink manufactured by Advanced Thermal Solutions (ATS) as part of their **pushPIN™** series. It is designed to manage the thermal output of electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions** | 50mm x 50mm x 25mm | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 3.18 °C/W (at 100 LFM) | | **Pitch** | Fine Pitch (High Surface Area) | --- ### 2. Key Component Features #### A. Attachment Mechanism (pushPIN™) Unlike adhesive-based heat sinks, the **R0** designation indicates a push-pin attachment system. This involves: * **Compression Springs:** Provide a precise, consistent downward force to ensure optimal contact with the electronic component. * **Plastic/Brass Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). #### B. Thermal Interface Material (TIM) This specific model usually comes with **T766** pre-applied thermal interface material. This ensures that air gaps between the heat sink base and the electronic chip are minimized, facilitating better heat transfer. #### C. Fin Design The **straight-fin** geometry is optimized for forced-air cooling (fan-driven airflow). The "Fine Pitch" design provides a larger surface area, allowing it to dissipate heat more efficiently than standard extruded heat sinks of the same size. --- ### 3. Application Use Cases This part is typically integrated into the following electronic systems: 1. **Telecommunications:** High-speed routers and switches. 2. **Power Electronics:** Power converters and motor drives. 3. **Embedded Systems:** Industrial PCs and automation controllers where space is limited but thermal loads are high. --- ### 4. Thermal Performance Comparison *Under typical airflow conditions (Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 3.18 | | 300 | 1.5 | 1.53 | | 500 | 2.5 | 1.23 |