The **ATS-04H-121-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to ensure system stability. --- ### 1. Technical Specifications The following table summarizes the core electronic and physical attributes of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-pin (Brass) | | **Spring Type** | Compression Spring (Stainless Steel) | | **Thermal Resistance** | 9.48°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Breakdown #### A. The Heat Sink Body The part utilizes a **straight-fin design** made from aluminum. This maximizes surface area for convective cooling. The "C2" in the part number indicates the material/finish grade, which in this case is a blue anodized coating that protects against corrosion and increases thermal emissivity. #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical push-pin system. * **Brass Pins:** Provide a secure, vibration-resistant connection to the PCB. * **Compression Springs:** Ensure consistent pressure between the heat sink and the electronic chip, which is critical for efficient heat transfer. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T766**. In electronics, the TIM fills microscopic air gaps between the component (heat source) and the heat sink. This reduces thermal resistance significantly compared to "dry" mounting. --- ### 3. Thermal Performance Profile Thermal resistance is measured in °C/W (Degrees Celsius per Watt), indicating how much the temperature rises for every watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (Ducted) | Thermal Resistance (Unducted) | | :--- | :--- | :--- | | 100 (0.5 m/s) | 4.43 °C/W | 9.48 °C/W | | 300 (1.5 m/s) | 2.01 °C/W | 3.20 °C/W | | 500 (2.5 m/s) | 1.47 °C/W | 2.13 °C/W | --- ### 4. Applications This part is commonly found in: * **Network Switches/Routers:** Cooling high-speed processing ASICs. * **Embedded Systems:** Industrial PCs where space is limited but heat is high. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators.