The **ATS-04H-08-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### Technical Specifications The following table outlines the key physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Fin Style** | Push-Pin (Straight Fin) | | **Attachment Method** | Push-Pins with Springs | | **Thermal Resistance** | 14.71°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 15.00mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### Component Breakdown #### 1. Push-Pin Attachment Mechanism The "C3" in the part number refers to the specific attachment hardware. - **Design:** It uses plastic push-pins and compression springs. - **Benefit:** This ensures consistent pressure between the heat sink and the component, optimizing heat transfer and making installation tool-less. #### 2. Material and Finish - **Aluminum:** Lightweight and offers excellent thermal conductivity for standard electronic applications. - **Blue Anodized:** The coating protects the aluminum from corrosion and slightly increases emissivity, which helps with radiant cooling. #### 3. Thermal Interface Material (TIM) The unit comes pre-applied with **T412**, which is a high-performance thermal tape/pad. This eliminates the need for manual application of thermal paste, ensuring a clean and reliable thermal bond between the chip and the heat sink. #### 4. Fin Profile The straight-fin design is optimized for **forced air cooling**. While it can work in natural convection environments, it performs best when paired with a system fan that provides steady airflow across the aluminum fins. --- ### Performance Data (Airflow vs. Thermal Resistance) As airflow increases, the thermal resistance (the ability of the part to resist heat buildup) decreases: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 14.71 | | 300 (1.5 m/s) | 5.83 | | 500 (2.5 m/s) | 4.13 | | 700 (3.5 m/s) | 3.40 |