The **ATS-04H-05-C2-R0** is a specific electronic component categorized as a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" thermal management series designed for PCB cooling. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of this component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-04H-05-C2-R0 | | **Thermal Resistance** | 8.72°C/W (at 100 LFM) | | **Fin Style** | Fine-Pitch (Cross-Cut) | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | --- ### 2. Key Design Features * **Fine-Pitch Geometry:** The "05" in the part number indicates a specific fin density. This design maximizes surface area while allowing air to pass through efficiently, making it ideal for systems with high-density components. * **pushPIN™ Attachment:** This system replaces traditional adhesive tapes or clunky clips. It uses a flexible, spring-loaded mechanism that ensures: * **Consistent Pressure:** Optimizes the interface between the heat sink and the chip. * **Secure Mounting:** Prevents the heat sink from shifting due to vibration. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance thermal grease (Phase Change Material) to ensure immediate out-of-the-box installation. --- ### 3. Part Number Breakdown The nomenclature for this part can be decoded as follows: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **04** | Form factor / Series index | | **H** | High-performance fin type | | **05** | Specific height/dimension variant (25mm height) | | **C2** | Thermal performance/Material grade (Blue Anodized) | | **R0** | RoHS compliance / Revision level | --- ### 4. Typical Applications This heat sink is commonly used in high-power electronic environments, including: * **Networking Equipment:** Routers and switches. * **Industrial PCs:** High-load microprocessors. * **Power Supplies:** Heat dissipation for MOSFETs or IGBS. * **FPGA Cooling:** Thermal management for programmable logic devices.