The **ATS-04F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** series, designed to dissipate heat from electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Attachment Method** | pushPIN™ (Brass pins / Steel springs) | | **Thermal Resistance** | 6.80°C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Electronic & Mechanical Components #### 1. Heat Sink Body (maxiFLOW™ Design) The body is constructed from aluminum with a specialized fin geometry. The maxiFLOW™ design features a flared fin structure that maximizes surface area and optimizes airflow, significantly reducing thermal resistance compared to standard straight-fin heatsinks. #### 2. pushPIN™ Attachment System Instead of using messy adhesives or thermal tape, this part uses a mechanical **pushPIN™** system. * **Pins:** Usually made of brass or plastic. * **Springs:** Provides a consistent "compression force" (calculated for optimal heat transfer) to ensure the heatsink stays in firm contact with the electronic chip. * **Benefits:** This prevents the heatsink from shifting during vibrations or thermal expansion. #### 3. Thermal Interface Material (TIM): T766 The base of the heatsink comes pre-applied with **T766**. In electronics, a TIM is essential to fill the microscopic air gaps between the component (the heat source) and the heatsink. T766 is a high-performance phase-change material that ensures maximum heat conductivity. --- ### Applications in Electronics This specific part is typically used for cooling: * **BGA (Ball Grid Array) Packages:** High-speed processors. * **FPGA/ASIC:** Custom integrated circuits that generate significant heat. * **Telecommunications Equipment:** High-density boards where airflow is restricted. ---