ATS-04F-79-C2-R0
AI

The **ATS-04F-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Material** | Aluminum |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Resistance** | 26.32°C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W)** | 25mm x 25mm |
| **Height** | 30mm |
| **Finish** | Blue Anodized |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Design and Component Features
#### A. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, the "04F" series utilizes a mechanical push-pin system.
- **Spring Loading:** Ensures constant pressure between the heat sink and the component, improving heat transfer.
- **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal expansion.
#### B. Fin Configuration
The **C2** designation refers to the specific "Cross-Cut" or pin-fin design.
- **Airflow:** The design allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of the direction the cooling fan is blowing.
- **Surface Area:** The 30mm height provides a large surface area for heat exchange relative to its small 25mm footprint.
#### C. Material and Finish
- **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties.
- **Blue Anodized:** The anodization provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat loss.
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### 3. Application Use Cases
This part is typically found in dense electronic assemblies where space is limited but heat output is high:
* **Networking Equipment:** Routers, switches, and high-speed modems.
* **Embedded Systems:** Industrial PCs or single-board computers (SBCs).
* **Power Supplies:** Cooling voltage regulators or power MOSFETs.
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- ⤷What are the differences between ducted and unducted thermal resistance for this part?
- ⤷ How does the pushPIN mounting system compare to thermal tape?
- ⤷ What is the specific thermal conductivity of the T766 interface material?