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  • ATS-04F-79-C2-R0

  • AI
    The **ATS-04F-79-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 26.32°C/W (Unducted @ 100 LFM) | | **Dimensions (L x W)** | 25mm x 25mm | | **Height** | 30mm | | **Finish** | Blue Anodized | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, the "04F" series utilizes a mechanical push-pin system. - **Spring Loading:** Ensures constant pressure between the heat sink and the component, improving heat transfer. - **Reliability:** Prevents the heat sink from shifting or falling off due to vibration or thermal expansion. #### B. Fin Configuration The **C2** designation refers to the specific "Cross-Cut" or pin-fin design. - **Airflow:** The design allows for omnidirectional airflow, meaning it can dissipate heat effectively regardless of the direction the cooling fan is blowing. - **Surface Area:** The 30mm height provides a large surface area for heat exchange relative to its small 25mm footprint. #### C. Material and Finish - **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. - **Blue Anodized:** The anodization provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat loss. --- ### 3. Application Use Cases This part is typically found in dense electronic assemblies where space is limited but heat output is high: * **Networking Equipment:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs or single-board computers (SBCs). * **Power Supplies:** Cooling voltage regulators or power MOSFETs. ---
    ✨ Follow-up Questions
    • ⤷What are the differences between ducted and unducted thermal resistance for this part?
    • ⤷ How does the pushPIN mounting system compare to thermal tape?
    • ⤷ What is the specific thermal conductivity of the T766 interface material?