The **ATS-04F-77-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 20.00mm | | **Fin Style** | Straight (Fine Pitch) | | **Thermal Resistance (Unducted)** | 9.30 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a mechanical push-pin system. - **Reliability:** Ensures consistent pressure across the component surface, which is critical for heat transfer. - **Serviceability:** Allows for easy removal and re-installation without damaging the PCB or the chip. ### B. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal grease. This fills the microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink base, significantly reducing thermal resistance. ### C. Fin Geometry The "77" in the part number refers to the specific fin design. The fine-pitch straight fins are optimized for **forced air-flow** environments (fans). This design maximizes the surface area while minimizing the pressure drop. --- ## 3. Application Use Cases The ATS-04F-77-C2-R0 is typically used in space-constrained electronic assemblies: * **Networking Gear:** Routers, switches, and high-speed modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Small MOSFET arrays or voltage regulators. ---