The **ATS-04F-76-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 11.84°C/W (at 100 LFM) to 2.18°C/W (at 700 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 10mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ### 2. Key Design Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses a **Spring-Loaded Push-Pin** mechanism. * **Benefit:** Provides consistent, high interface pressure onto the electronic component, which improves thermal transfer. * **Installation:** Requires pre-drilled holes in the Printed Circuit Board (PCB). #### B. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** The "C3" in the part number indicates the finish. Anodizing increases surface emissivity (the ability to radiate heat) and provides electrical insulation and corrosion resistance. #### C. Thermal Performance The "R0" suffix indicates that the product is RoHS compliant. The thermal resistance varies significantly based on airflow (LFM - Linear Feet per Minute): * **Natural Convection:** Low efficiency; the part relies on surrounding air movement. * **Forced Air (Fans):** High efficiency; as airflow increases from 100 to 700 LFM, the resistance drops significantly, allowing the component to handle higher power loads. --- ### 3. Common Applications This specific small-form-factor heat sink (25mm x 25mm) is typically used for: * **Embedded Systems:** Cooling small ARM processors or SOCs. * **Telecommunications:** Transceivers and network switch chips. * **Power Supplies:** Cooling MOSFETs or voltage regulators.