The **ATS-04F-75-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for cooling electronic components like CPUs, GPUs, or power transistors. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded plastic pins) | | **Dimensions** | 25mm x 25mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 1.48 °C/W (@ 100 LFM) | | **Thermal Interface Material (TIM)** | None (Blue Anodized Finish) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's geometry and mounting: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04**: Series identifier. * **F**: Fin pitch/style (likely "Fine" or "Flat" profile). * **75**: Dimensions/Specific footprint code. * **C1**: Color/Finish (C1 typically denotes a blue anodized finish). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Features * **High Aspect Ratio:** The "Straight Fin" design allows for maximum surface area to dissipate heat efficiently in environments with high airflow. * **PushPIN™ Attachment:** This system features a flexible, tool-less installation method. It uses a pre-assembled brass or plastic pin with a stainless steel spring to provide consistent pressure on the electronic component. * **Material Efficiency:** Made from extruded aluminum (6063), which offers a great balance between thermal conductivity and weight. * **Pre-Drilled Holes:** The heat sink comes with standardized hole patterns (e.g., 20mm or custom centers) to match common PCB layouts. --- ### 4. Application and Use Cases This heat sink is typically used in space-constrained environments where vertical height (30mm) is available, but the footprint (25mm x 25mm) is limited. Common applications include: * **Embedded Systems:** For cooling small processors. * **Networking Equipment:** Routers and switches. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators.