The **ATS-04F-68-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components such as CPUs, GPUs, and power transistors in environments with high airflow. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal properties: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Base Dimensions** | 45mm x 45mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Brass/Plastic pins) | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) to 1.73°C/W (at 700 LFM) | | **Pressure Drop** | 0.11 in-H2O (at 200 LFM) | --- ## 2. Component Features * **pushPIN™ Attachment:** This model uses a spring-loaded pin system for mounting. This ensures precise pressure across the interface material, optimizing heat transfer from the chip to the sink. * **Cross-Cut/Straight Fin Design:** The fin geometry is optimized for forced convection (fans). It provides a high surface area to dissipate heat quickly while maintaining a low profile. * **Pre-Applied Interface:** Most "R0" series parts come with **Phase Change Material (PCM)** or high-performance Thermal Interface Material (TIM) pre-applied to the base for immediate installation. --- ## 3. Ideal Use Cases This heat sink is typically used in the following electronic systems: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and high-density power modules. 4. **Telecommunications:** Base stations and signal processing units. --- ## 4. Part Number Breakdown The suffix **"C2"** indicates the thermal interface material and finish. In this case, it usually refers to a Blue Anodized finish with a specific T766 thermal pad or equivalent. The **"R0"** indicates the revision level and packaging standard.