ATS-04F-64-C2-R0
AI

The **ATS-04F-64-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic components like CPUs, GPUs, or power transistors.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 40.00 mm x 40.00 mm |
| **Height** | 25.00 mm |
| **Fin Type** | Fine Pitch (Square Pattern) |
| **Thermal Resistance (Unducted)** | 9.39 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.64 °C/W @ 100 LFM |
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### 2. Key Features and Components
The part is composed of three primary electronic/mechanical sub-parts:
1. **Heat Sink Body:**
* Made of high-grade aluminum for optimal heat dissipation.
* The **Fine Pitch** design increases surface area, allowing for better cooling in airflow-restricted environments.
2. **pushPIN™ Attachment Mechanism:**
* Replaces traditional adhesive tapes or screws.
* Uses a brass or plastic pin with a stainless steel spring to provide precise pressure on the electronic chip, ensuring a consistent thermal interface.
3. **Thermal Interface Material (TIM):**
* The "C2" in the part number indicates it comes pre-applied with **T766** thermal phase change material or grease, which fills microscopic air gaps between the component and the heat sink.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying its specific application:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04:** Series type.
* **F:** Fin pitch style (Fine).
* **64:** Specific dimension/model code.
* **C2:** Thermal Interface Material (TIM) type and color/finish code.
* **R0:** RoHS compliance and revision status.
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### 4. Application Usage
This part is typically found in:
* **Networking Hardware:** Routers, switches, and high-speed modems.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Power Electronics:** Cooling MOSFETs or voltage regulators that generate significant heat during operation.
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What are the advantages of using pushPIN™ over traditional adhesive thermal tapes?
- ⤷ How does the 'ducted' vs 'unducted' thermal resistance impact the choice of cooling fans?
- ⤷ Can this heat sink be customized for different heights or materials?