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  • ATS-04F-34-C2-R0

  • AI
    The **ATS-04F-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for board-level thermal management of electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 14.33°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm | | **Fin Style** | Straight Fin | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Components #### A. pushPIN™ Attachment System This heat sink uses the proprietary **pushPIN™** system, which replaces traditional adhesive tapes or fragile clips. * **Benefits:** Ensures consistent pressure (preload) for maximum heat transfer. * **Hardware:** Includes a brass or plastic pin with a stainless steel compression spring. #### B. Heat Sink Geometry (Straight Fin) The fins are oriented in a straight pattern, making it ideal for **unidirectional airflow**. The 35mm height provides a large surface area for heat dissipation, though it requires sufficient vertical clearance in the electronic enclosure. #### C. Thermal Interface Material (TIM) The part comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the component die and the heat sink base. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 14.33 | 6.72 | 4.62 | 3.67 | --- ### 4. Part Number Breakdown The suffixing in ATS part numbers provides specific configuration data: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series/Attachment type. * **F:** Fin pitch/density. * **34:** Specific size/footprint code. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Packaging or Revision indicator.
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the pushPIN attachment?
    • ⤷ How does the T766 TIM compare to other thermal pads in terms of conductivity?
    • ⤷ Is there a low-profile version of this heat sink for 1U server applications?