ATS-04F-34-C2-R0
AI

The **ATS-04F-34-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for board-level thermal management of electronic components such as CPUs, GPUs, and other integrated circuits.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 14.33°C/W (Unducted Flow @ 200 LFM) |
| **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 35.00mm |
| **Fin Style** | Straight Fin |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
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### 2. Key Design Components
#### A. pushPIN™ Attachment System
This heat sink uses the proprietary **pushPIN™** system, which replaces traditional adhesive tapes or fragile clips.
* **Benefits:** Ensures consistent pressure (preload) for maximum heat transfer.
* **Hardware:** Includes a brass or plastic pin with a stainless steel compression spring.
#### B. Heat Sink Geometry (Straight Fin)
The fins are oriented in a straight pattern, making it ideal for **unidirectional airflow**. The 35mm height provides a large surface area for heat dissipation, though it requires sufficient vertical clearance in the electronic enclosure.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T766**, a high-performance thermal grease. This eliminates the need for manual application and ensures there are no air gaps between the component die and the heat sink base.
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### 3. Thermal Performance Profile
Thermal resistance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | 200 | 400 | 600 | 800 |
| :--- | :--- | :--- | :--- | :--- |
| **Thermal Resistance (°C/W)** | 14.33 | 6.72 | 4.62 | 3.67 |
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### 4. Part Number Breakdown
The suffixing in ATS part numbers provides specific configuration data:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04:** Series/Attachment type.
* **F:** Fin pitch/density.
* **34:** Specific size/footprint code.
* **C2:** Material/Finish code (Blue Anodized Aluminum).
* **R0:** Packaging or Revision indicator.
- ⤷
What are the PCB hole diameter requirements for the pushPIN attachment?
- ⤷ How does the T766 TIM compare to other thermal pads in terms of conductivity?
- ⤷ Is there a low-profile version of this heat sink for 1U server applications?