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  • ATS-04F-22-C2-R0

  • AI
    The **ATS-04F-22-C2-R0** is a high-performance electronic component specifically designed for **thermal management**. It is a heat sink manufactured by *Advanced Thermal Solutions, Inc.*, primarily used to dissipate heat from integrated circuits (ICs) and other surface-mount components. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Thermal Resistance** | 13.87° C/W (at 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Fine-Pitch (Straight) | --- ### 2. Key Features and Components This heat sink is part of the **pushPIN™** series, which incorporates several distinct engineering features: * **Attachment Mechanism:** It uses a brass or plastic push-pin with a stainless steel spring. This provides a precise "compression force" to ensure the heat sink remains in constant contact with the processor or component. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766**, a high-efficiency thermal grease that fills microscopic air gaps between the component and the heat sink base. * **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer. --- ### 3. Functional Purpose In an electronic circuit, the ATS-04F-22-C2-R0 serves the following roles: 1. **Heat Dissipation:** It increases the surface area of a hot component, allowing air (via natural or forced convection) to carry heat away. 2. **Thermal Protection:** It prevents "Thermal Throttling" or hardware failure in CPUs, GPUs, or Power Modules by keeping junction temperatures within safe limits. 3. **Mechanical Stability:** The pushPIN™ system ensures the part does not shift during vibration or shipping, which is critical for industrial or telecommunication equipment. --- ### 4. Implementation Example If you were integrating this into a PCB design, your CAD library would need to account for the mounting holes: ```markdown # PCB Layout Requirements - Hole Diameter: 3.175mm (typical for pushPIN) - Hole Pitch: 47.00mm (standard for 54mm body size) - Component Clearance: 12.7mm vertical height clearance required. ```
    ✨ Follow-up Questions
    • ⤷ What is the difference between pushPIN and adhesive-backed heat sinks?
    • ⤷ How do I calculate if the 13.87° C/W thermal resistance is sufficient for my chip?
    • ⤷ Does this model support different spring tensions for varying pressure requirements?