AI

The **ATS-04F-22-C2-R0** is a high-performance electronic component specifically designed for **thermal management**. It is a heat sink manufactured by *Advanced Thermal Solutions, Inc.*, primarily used to dissipate heat from integrated circuits (ICs) and other surface-mount components.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Characteristic | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm |
| **Thermal Resistance** | 13.87° C/W (at 100 LFM) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Fin Style** | Fine-Pitch (Straight) |
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### 2. Key Features and Components
This heat sink is part of the **pushPIN™** series, which incorporates several distinct engineering features:
* **Attachment Mechanism:** It uses a brass or plastic push-pin with a stainless steel spring. This provides a precise "compression force" to ensure the heat sink remains in constant contact with the processor or component.
* **Thermal Interface Material (TIM):** This part usually comes pre-applied with **T766**, a high-efficiency thermal grease that fills microscopic air gaps between the component and the heat sink base.
* **Blue Anodized Finish:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves radiant heat transfer.
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### 3. Functional Purpose
In an electronic circuit, the ATS-04F-22-C2-R0 serves the following roles:
1. **Heat Dissipation:** It increases the surface area of a hot component, allowing air (via natural or forced convection) to carry heat away.
2. **Thermal Protection:** It prevents "Thermal Throttling" or hardware failure in CPUs, GPUs, or Power Modules by keeping junction temperatures within safe limits.
3. **Mechanical Stability:** The pushPIN™ system ensures the part does not shift during vibration or shipping, which is critical for industrial or telecommunication equipment.
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### 4. Implementation Example
If you were integrating this into a PCB design, your CAD library would need to account for the mounting holes:
```markdown
# PCB Layout Requirements
- Hole Diameter: 3.175mm (typical for pushPIN)
- Hole Pitch: 47.00mm (standard for 54mm body size)
- Component Clearance: 12.7mm vertical height clearance required.
```
- ⤷
What is the difference between pushPIN and adhesive-backed heat sinks?
- ⤷ How do I calculate if the 13.87° C/W thermal resistance is sufficient for my chip?
- ⤷ Does this model support different spring tensions for varying pressure requirements?