The **ATS-04F-191-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-04F-191-C2-R0 | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 2.90°C/W (at 200 LFM) | | **Flow Orientation** | Vertical / Side-blown | --- ### 2. Physical Dimensions The physical footprint is critical for determining PCB clearance and compatibility with neighboring components. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 30.00 mm (High profile) * **Fin Pitch:** Fine-pitch straight fins for optimized airflow. --- ### 3. Core Electronic & Thermal Components #### A. The Heat Sink Body The body is made from **Aluminum 6063**, which is chosen for its excellent thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better heat radiation. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "C2" designation refers to a specific push-pin and spring kit: * **Springs:** Provides consistent downward pressure (clamping force) on the chip, ensuring the thermal interface material (TIM) fills all microscopic gaps. * **Push-Pins:** These snap into 3.0mm diameter holes pre-drilled in the PCB, offering a more secure mechanical bond than thermal tape. #### C. Thermal Interface Material (TIM) This specific model usually comes pre-applied with **ATS-PPS-11**, a high-performance thermal grease or pad. This eliminates the need for the user to apply thermal paste manually, ensuring a uniform layer between the heat sink base and the electronic component. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 3.97 | | **200** | 2.90 | | **300** | 2.35 | | **400** | 2.10 | --- ### 5. Common Applications * **Embedded Systems:** Cooling FPGAs or ARM processors. * **Networking:** Used on high-speed switches and routers. * **Power Electronics:** Cooling MOSFET arrays or voltage regulators.