The **ATS-04F-181-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" thermal management line, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Dimensions** | 40.00mm x 40.00mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.95 °C/W (Unducted Flow @ 100 LFM) | | **Fin Type** | Fine Pitch (Cross-cut) | | **Surface Finish** | Blue Anodized | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04**: Series number. * **F**: Fin pitch/density (indicates "Fine" pitch). * **181**: Specific footprint/size profile. * **C2**: Thermal interface material (typically indicates a specific pre-applied T766 phase change material or high-performance grease). * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic/Mechanical Features #### A. Attachment Mechanism (pushPIN™) The "pushPIN" system consists of a flexible, spring-loaded pin that passes through pre-drilled holes in the PCB. This ensures: 1. **Uniform Pressure**: Prevents cracking of delicate silicon dies. 2. **Secure Fit**: High vibration resistance for industrial or aerospace applications. 3. **Efficiency**: Eliminates the need for messy adhesives. #### B. Thermal Interface Material (TIM) The **C2** designation indicates that the heat sink comes with a pre-applied high-performance thermal pad or grease. This material fills the microscopic air gaps between the heat source (the chip) and the heat sink base, significantly reducing thermal resistance. #### C. Cross-Cut Fin Design The fins are cut in both vertical and horizontal directions. This allows for: * **Multi-directional airflow**: The heat sink performs well regardless of which direction the cooling fan is blowing. * **Increased Surface Area**: Maximizes the contact area with air for heat dissipation. --- ### 4. Typical Applications * **Field Programmable Gate Arrays (FPGAs)** * **Application Specific Integrated Circuits (ASICs)** * **Network Switches and Routers** * **Embedded Computing Boards**