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  • ATS-04F-166-C3-R0

  • AI
    The **ATS-04F-166-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed specifically for cooling electronic components like CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 25mm x 25mm x 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 3.91 °C/W @ 100 LFM | | **Thermal Interface Material (TIM)** | T412 (High performance) | --- ### 2. Key Components & Design Features #### A. The Heat Sink Body The part is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design provides a high surface area to volume ratio, which is ideal for environments with steady airflow. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical mounting system: * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB. * **Compression Springs:** Ensure constant, high pressure between the heat sink and the component, maximizing heat transfer. #### C. Thermal Interface Material (TIM) The base comes pre-applied with **T412**, a phase-change material or high-quality thermal grease. This fills microscopic air gaps between the component and the heat sink to reduce thermal resistance. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04** | Series Identifier | | **F** | Fin Pitch / Density | | **166** | Size / Model Code | | **C3** | Thermal Performance Grade | | **R0** | Revision / RoHS Compliance Status | --- ### 4. Typical Applications * **Networking:** Cooling for high-speed routers and switches. * **Embedded Systems:** Microcontrollers and SoCs. * **Power Electronics:** Small MOSFET arrays or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ What is the hole pattern required on the PCB for this heat sink?
    • ⤷ How does the T412 thermal material compare to standard thermal paste?
    • ⤷ Are there CAD models available for integrating this part into a mechanical design?