ATS-04F-166-C3-R0
AI

The **ATS-04F-166-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series and is designed specifically for cooling electronic components like CPUs, GPUs, or high-power semiconductors.
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### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W x H)** | 25mm x 25mm x 15mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance (Unducted)** | 12.30 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 3.91 °C/W @ 100 LFM |
| **Thermal Interface Material (TIM)** | T412 (High performance) |
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### 2. Key Components & Design Features
#### A. The Heat Sink Body
The part is made of **Aluminum 6063**, chosen for its excellent thermal conductivity and lightweight properties. The "Straight Fin" design provides a high surface area to volume ratio, which is ideal for environments with steady airflow.
#### B. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical mounting system:
* **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB.
* **Compression Springs:** Ensure constant, high pressure between the heat sink and the component, maximizing heat transfer.
#### C. Thermal Interface Material (TIM)
The base comes pre-applied with **T412**, a phase-change material or high-quality thermal grease. This fills microscopic air gaps between the component and the heat sink to reduce thermal resistance.
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### 3. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Advanced Thermal Solutions (Manufacturer) |
| **04** | Series Identifier |
| **F** | Fin Pitch / Density |
| **166** | Size / Model Code |
| **C3** | Thermal Performance Grade |
| **R0** | Revision / RoHS Compliance Status |
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### 4. Typical Applications
* **Networking:** Cooling for high-speed routers and switches.
* **Embedded Systems:** Microcontrollers and SoCs.
* **Power Electronics:** Small MOSFET arrays or voltage regulators.
- ⤷
What is the hole pattern required on the PCB for this heat sink?
- ⤷ How does the T412 thermal material compare to standard thermal paste?
- ⤷ Are there CAD models available for integrating this part into a mechanical design?