ATS-04F-153-C2-R0
AI

The **ATS-04F-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules.
---
## Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-04F-153-C2-R0 |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 35mm x 35mm x 30mm |
| **Thermal Resistance (Unducted)** | 4.05 °C/W @ 100 LFM |
| **Thermal Resistance (Ducted)** | 1.83 °C/W @ 100 LFM |
| **Thermal Interface Material** | T766 (High Performance Phase Change) |
---
## Key Features
### 1. pushPIN™ Attachment System
This part uses a specialized spring-loaded mechanism that ensures:
* **Constant Pressure:** Prevents damage to the silicon die while maintaining optimal contact.
* **Ease of Install:** No complex tools are required; it snaps into pre-drilled holes on the PCB.
* **Reliability:** Resistant to vibration and mechanical shock.
### 2. Fin Design (Cross-Cut)
The unit features a **fine-pitch cross-cut fin pattern**. This geometry increases surface area and allows for airflow from any direction (omni-directional), making it ideal for systems where the airflow direction might be restricted or unpredictable.
### 3. Thermal Interface Material (TIM)
The "C2" in the part number indicates it comes pre-applied with **T766 phase-change material**. This material offers lower thermal resistance compared to standard pads and is designed to fill microscopic gaps between the heat source and the heat sink base effectively.
---
## Performance Comparison (Airflow)
| Air Velocity (LFM) | Velocity (m/s) | Resistance (°C/W) - Unducted |
| :--- | :--- | :--- |
| 100 | 0.5 | 4.05 |
| 300 | 1.5 | 2.30 |
| 500 | 2.5 | 1.81 |
| 700 | 3.5 | 1.56 |
---
## Mechanical Drawing Concept
The following is a representation of how the dimensions are calculated:
```markdown
<-- 35mm -->
+------------+ ^
| |||||||| | |
| |||||||| | 35mm
| |||||||| | |
+------------+ v
(Base Height: 30mm)
```
- ⤷
What are the PCB hole diameter requirements for this pushPIN system?
- ⤷ How does Blue Anodized finish affect thermal performance compared to Black Anodized?
- ⤷ Can the pre-applied T766 thermal material be replaced with standard thermal paste?