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  • ATS-04F-153-C2-R0

  • AI
    The **ATS-04F-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and power modules. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-04F-153-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 35mm x 35mm x 30mm | | **Thermal Resistance (Unducted)** | 4.05 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.83 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (High Performance Phase Change) | --- ## Key Features ### 1. pushPIN™ Attachment System This part uses a specialized spring-loaded mechanism that ensures: * **Constant Pressure:** Prevents damage to the silicon die while maintaining optimal contact. * **Ease of Install:** No complex tools are required; it snaps into pre-drilled holes on the PCB. * **Reliability:** Resistant to vibration and mechanical shock. ### 2. Fin Design (Cross-Cut) The unit features a **fine-pitch cross-cut fin pattern**. This geometry increases surface area and allows for airflow from any direction (omni-directional), making it ideal for systems where the airflow direction might be restricted or unpredictable. ### 3. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes pre-applied with **T766 phase-change material**. This material offers lower thermal resistance compared to standard pads and is designed to fill microscopic gaps between the heat source and the heat sink base effectively. --- ## Performance Comparison (Airflow) | Air Velocity (LFM) | Velocity (m/s) | Resistance (°C/W) - Unducted | | :--- | :--- | :--- | | 100 | 0.5 | 4.05 | | 300 | 1.5 | 2.30 | | 500 | 2.5 | 1.81 | | 700 | 3.5 | 1.56 | --- ## Mechanical Drawing Concept The following is a representation of how the dimensions are calculated: ```markdown <-- 35mm --> +------------+ ^ | |||||||| | | | |||||||| | 35mm | |||||||| | | +------------+ v (Base Height: 30mm) ```
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for this pushPIN system?
    • ⤷ How does Blue Anodized finish affect thermal performance compared to Black Anodized?
    • ⤷ Can the pre-applied T766 thermal material be replaced with standard thermal paste?