The **ATS-04F-149-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to define the dimensions, fin pattern, and thermal performance. | Specification | Value / Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Type** | Board Level, Push-Pin Heat Sink | | **Material** | Aluminum (High thermal conductivity) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 20.00mm | | **Attachment Method** | Push-Pin (2-piece assembly) | | **Thermal Resistance** | ~6.21°C/W (Unducted Flow @ 200 LFM) | | **Fin Pattern** | Blue Anodized, Straight Fin / Cross-Cut | --- ### 2. Key Components & Features #### A. The Fin Design (Cross-Cut) The "F" in the part number often indicates a specific fin density. This model utilizes a **cross-cut** or **pin-fin** style logic which: * Increases the surface area for heat exchange. * Allows for multi-directional airflow, making it efficient in systems where the air direction might be turbulent or non-linear. #### B. Push-Pin Attachment Mechanism This part uses a **spring-loaded push-pin** system. * **Security:** Provides consistent pressure (clamping force) on the high-power component. * **Reliability:** Unlike adhesive tapes, push-pins do not degrade over time due to heat. * **PCB Requirements:** Requires two pre-drilled holes in the PCB to lock the pins. #### C. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the heat sink comes with **T766 Phase Change Material** or a similar high-performance thermal pad pre-applied to the base. This fills the microscopic air gaps between the component and the heat sink. --- ### 3. Usage Context This heat sink is commonly found in the following electronic applications: 1. **Telecommunications:** Cooling of high-speed processors in routers and switches. 2. **Embedded Systems:** Industrial PCs where active fan cooling may not be feasible. 3. **Power Supplies:** Cooling MOSFETs or Voltage Regulators. --- ### 4. Part Number Breakdown (Sample) ```text ATS - 04 - F - 149 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------- Dimensional/Pattern Code | | +------------------ Fin Style/Density | +----------------------- Series Number +----------------------------- Advanced Thermal Solutions ```