The **ATS-04F-142-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is designed for thermal management in electronic devices, specifically for cooling integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 15.00mm | | **Thermal Resistance** | 10.07° C/W (@ 100 LFM) | | **Airflow Pattern** | Fine-pitch, Straight Fin | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the product's features: - **ATS**: Manufacturer (Advanced Thermal Solutions). - **04**: Heat sink series/height category. - **F**: Fin pitch/style (Fine pitch). - **142**: Dimensional code (30mm x 30mm base). - **C2**: Thermal Interface Material (TIM) and color. "C2" typically indicates **T766 Phase Change Material** and a **Blue Anodized** finish. - **R0**: Revision or packaging code. --- ### 3. Key Component Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This provides: - **Uniform Pressure**: Ensures the heat sink is pressed firmly against the component for maximum heat transfer. - **Reusability**: Can be removed and reattached easily during maintenance or testing. - **Secure Mounting**: Pre-drilled holes in the PCB are required to lock the pins. #### B. Fine-Pitch Straight Fins The straight fin design is optimized for **forced air cooling** (environments with a fan). The high fin density increases the surface area, allowing heat to dissipate more efficiently into the passing airstream. #### C. Pre-Applied TIM (Thermal Interface Material) The base comes with **T766** pre-applied. This is a phase-change material that fills microscopic air gaps between the chip and the heat sink base, significantly reducing thermal resistance compared to air. --- ### 4. Application Use Cases * **Networking Hardware**: Routers and switches with high-speed processors. * **Embedded Systems**: Industrial computers or controllers. * **Power Supplies**: Cooling voltage regulators or power transistors.