The **ATS-04F-129-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part belongs to the **pushPIN™** series, which uses a specific spring-loaded mechanism for attachment. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 8.68°C/W (Unducted Flow @ 100 LFM) | | **Dimensions** | 54.00mm x 54.00mm | | **Height** | 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Electronic & Mechanical Components ### A. Fin Design (Vertical Fins) The unit features a **Fine Pitch** fin design. This increases the surface area available for convection. In electronics, the more surface area exposed to air, the faster the heat can be transferred away from the silicon die. ### B. Thermal Interface Material (TIM) The bottom of this heat sink comes with **T766** pre-applied. - **Purpose:** In electronic assemblies, there are microscopic air gaps between the component (e.g., a microprocessor) and the heat sink. Air is a poor conductor. The T766 TIM fills these gaps to ensure maximum thermal conductivity. ### C. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this uses a mechanical locking system: - **Springs:** Provide constant, uniform pressure (load) across the electronic component. - **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the Printed Circuit Board (PCB). --- ## 3. Thermal Performance Data Performance in electronic cooling is measured by thermal resistance (°C/W). A lower value indicates better cooling. | Airflow (LFM) | Velocity (m/s) | Resistance (Unducted) | Resistance (Ducted) | | :--- | :--- | :--- | :--- | | 100 | 0.5 | 8.68 °C/W | 1.59 °C/W | | 300 | 1.5 | 3.11 °C/W | 1.07 °C/W | | 500 | 2.5 | 2.25 °C/W | 0.89 °C/W | --- ## 4. Application in Circuits This part is typically used for: 1. **FPGA/ASIC Cooling:** High-density integrated circuits that generate significant heat during logic operations. 2. **Power Supplies:** Managing heat in MOSFETs or voltage regulators. 3. **Embedded Systems:** Where low-profile (10mm height) is required due to chassis constraints.