The **ATS-04F-121-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically to dissipate heat from electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance (Unducted)** | 3.95 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.90 °C/W @ 100 LFM | | **Weight** | 1.83 oz (approx. 52g) | --- ### 2. Key Design Elements #### A. The Fin Profile The "121" in the part number corresponds to a **Cross-Cut** fin design. This pattern allows for multi-directional airflow, making it highly effective in systems where the direction of the air from cooling fans might vary. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or complex screws, this part uses a **push-pin and brass spring** mechanism: * **Ease of Assembly:** Ensures even pressure across the component surface. * **Reliability:** The springs provide a consistent "clamping force" that prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **T766** pre-applied thermal phase-change material. This ensures optimal thermal conductivity between the electronic chip and the aluminum base without requiring manual paste application. --- ### 3. Applications This part is commonly used in industrial and telecommunications hardware, including: * **Embedded Systems:** For cooling high-speed processors. * **Network Switches:** Handling heat from ASICs. * **Power Supplies:** Cooling MOSFETs or power conversion modules. ---