The **ATS-04D-71-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part number: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight (Cross-cut for airflow) | | **Thermal Resistance** | 1.10°C/W (at 200 LFM) | --- ### 2. Component Breakdown #### A. The Heat Sink Body The body is made of **AL6063 aluminum**, chosen for its excellent balance of thermal conductivity and weight. The "71" in the part number indicates a specific fin pattern designed for high-density cooling requirements. #### B. The Attachment System (Push-Pins) Unlike adhesive-based heat sinks, this model uses a mechanical **Push-Pin and Spring** system: * **Material:** Brass pins with stainless steel springs. * **Benefit:** Provides consistent downward pressure on the processor, ensuring maximum contact with the thermal interface material (TIM). * **Reliability:** Resistant to vibration and thermal expansion/contraction. #### C. Thermal Interface Material (TIM) The "C2" suffix indicates that the unit comes pre-applied with **ATS-91** (or equivalent) high-performance thermal phase-change material. This eliminates the need for separate thermal paste application during assembly. --- ### 3. Thermal Performance Profile The efficiency of the ATS-04D-71-C2-R0 is highly dependent on the Air Velocity (LFM - Linear Feet per Minute): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (Unducted) | 1.10 | | 400 (Unducted) | 0.85 | | 600 (Unducted) | 0.70 | --- ### 4. Application and Use Case This part is typically found in: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Where mechanical stability (push-pins) is required over adhesive tapes. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.