ATS-04D-63-C2-R0
AI

The **ATS-04D-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor components like CPUs, GPUs, and FPGAs.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Al6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded bolts) |
| **Thermal Resistance** | 12.32 °C/W (at 100 LFM) |
| **Dimensions (L x W)** | 40mm x 40mm |
| **Height** | 20mm |
| **Fin Pattern** | Square Pin Fin |
---
### 2. Detailed Component Breakdown
#### A. The Fin Design (Square Pin Fin)
Unlike standard straight-fin heat sinks, the "Square Pin" design allows for multi-directional airflow. This is critical in crowded PCB environments where air might not be moving in a single, predictable direction. It maximizes surface area while minimizing pressure drop.
#### B. The pushPIN™ Attachment System
The "04D" in the part number indicates a specific hardware configuration. This system replaces messy adhesives or weak clips with:
* **Steel Springs:** Provide precise "firm" pressure to ensure optimal contact with the component.
* **Plastic/Brass Push Pins:** Snap into pre-drilled holes in the PCB for a secure, vibration-resistant fit.
#### C. Thermal Performance (LFM - Linear Feet per Minute)
The efficiency of the ATS-04D-63-C2-R0 scales with airflow:
* **Unducted Flow:** ~12.32 °C/W @ 100 LFM.
* **High Airflow:** Drops significantly (to approx. 1.92 °C/W @ 700 LFM), making it highly effective in server chassis with high-speed fans.
---
### 3. Part Number Decoder (Breakdown)
| Segment | Code | Meaning |
| :--- | :--- | :--- |
| **Series** | ATS-04 | pushPIN™ Heat Sink Series |
| **Fin Pitch** | D | Fine Pitch (Specific to the 40mm platform) |
| **Dimension** | 63 | Specific internal design/size reference |
| **Material/Finish** | C2 | Aluminum / Blue Anodized |
| **RoHS** | R0 | RoHS Compliant |
---
### 4. Implementation Example
If you were designing a PCB for this part, you would need to include the following in your CAD layout:
```markdown
* Hole Pattern: 33mm x 33mm (typical for 40mm pushPIN)
* Hole Diameter: 3.175mm (approx. 1/8 inch)
* Keep-out Zone: 45mm x 45mm (to allow for spring clearance)
```
- ⤷
What are the recommended TIM (Thermal Interface Materials) to use with this heat sink?
- ⤷ How does the pressure of the pushPIN system affect the fragile silicon die?
- ⤷ Are there low-profile versions of the 40mm ATS series available?