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  • ATS-04D-63-C2-R0

  • AI
    The **ATS-04D-63-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductor components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 12.32 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Fin Pattern** | Square Pin Fin | --- ### 2. Detailed Component Breakdown #### A. The Fin Design (Square Pin Fin) Unlike standard straight-fin heat sinks, the "Square Pin" design allows for multi-directional airflow. This is critical in crowded PCB environments where air might not be moving in a single, predictable direction. It maximizes surface area while minimizing pressure drop. #### B. The pushPIN™ Attachment System The "04D" in the part number indicates a specific hardware configuration. This system replaces messy adhesives or weak clips with: * **Steel Springs:** Provide precise "firm" pressure to ensure optimal contact with the component. * **Plastic/Brass Push Pins:** Snap into pre-drilled holes in the PCB for a secure, vibration-resistant fit. #### C. Thermal Performance (LFM - Linear Feet per Minute) The efficiency of the ATS-04D-63-C2-R0 scales with airflow: * **Unducted Flow:** ~12.32 °C/W @ 100 LFM. * **High Airflow:** Drops significantly (to approx. 1.92 °C/W @ 700 LFM), making it highly effective in server chassis with high-speed fans. --- ### 3. Part Number Decoder (Breakdown) | Segment | Code | Meaning | | :--- | :--- | :--- | | **Series** | ATS-04 | pushPIN™ Heat Sink Series | | **Fin Pitch** | D | Fine Pitch (Specific to the 40mm platform) | | **Dimension** | 63 | Specific internal design/size reference | | **Material/Finish** | C2 | Aluminum / Blue Anodized | | **RoHS** | R0 | RoHS Compliant | --- ### 4. Implementation Example If you were designing a PCB for this part, you would need to include the following in your CAD layout: ```markdown * Hole Pattern: 33mm x 33mm (typical for 40mm pushPIN) * Hole Diameter: 3.175mm (approx. 1/8 inch) * Keep-out Zone: 45mm x 45mm (to allow for spring clearance) ```
    ✨ Follow-up Questions
    • ⤷ What are the recommended TIM (Thermal Interface Materials) to use with this heat sink?
    • ⤷ How does the pressure of the pushPIN system affect the fragile silicon die?
    • ⤷ Are there low-profile versions of the 40mm ATS series available?