The **ATS-04D-52-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) and surface-mount devices. --- ### 1. Technical Specifications The following table highlights the core physical and thermal properties of this specific part number: | Property | Value/Description | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Dimensions** | 35mm x 35mm x 25mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 10.79°C/W (at 1.0 m/s airflow) | | **Fin Type** | Straight Fin | | **Coating** | Blue Anodized | --- ### 2. Electronic/Thermal Functionality This part serves as a passive cooling solution. Its primary role in an electronic assembly is to: * **Increase Surface Area:** The "Straight Fin" design expands the contact area between the heat-generating component and the surrounding air. * **Thermal Conductivity:** Made of Aluminum 6063, it efficiently draws heat away from the silicon die. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied, which is a phase-change material that fills microscopic air gaps between the chip and the heat sink. --- ### 3. Attachment Mechanism: pushPIN™ One of the defining "electronic part" features of this model is its mechanical mounting system: * **Push-Pin:** It uses a spring-loaded plastic pin that snaps into pre-drilled holes on the Printed Circuit Board (PCB). * **Spring Force:** The spring provides consistent pressure, ensuring a secure thermal bond without over-stressing the delicate solder joints of the BGA or QFP package. --- ### 4. Part Number Breakdown (Nomenclature) To understand the variations, here is how the part number is structured: | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **04** | Push-pin style/series | | **D** | Material/Processing code | | **52** | Specific dimensional footprint code | | **C2** | Thermal performance/Fin configuration | | **R0** | RoHS Compliant / Revision code |