The **ATS-04D-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Off Base)** | 10.00 mm | | **Thermal Resistance** | 26.38° C/W (at 100 LFM) | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### ### Key Electronic Components & Features 1. **Heat Sink Body (Aluminum):** Aluminum is used for its excellent thermal conductivity-to-weight ratio. The "Fine Pitch" fin design increases the surface area, allowing more heat to transfer from the component to the surrounding air. 2. **Push-Pin Attachment:** The part number includes a specific mounting mechanism. Instead of adhesive tape, it uses **brass or plastic push-pins** with a compression spring. This ensures a consistent "Interface Pressure," which is critical for maximizing heat transfer across the Thermal Interface Material (TIM). 3. **Blue Anodized Coating:** The blue anodization is not just for aesthetics; it provides surface protection against corrosion and slightly improves radiant heat transfer compared to bare aluminum. 4. **Thermal Interface Material (TIM):** The "R0" suffix typically indicates the inclusion of a pre-applied high-performance thermal pad or grease (such as T766), ensuring there are no air gaps between the electronic chip and the heat sink base. --- ### ### Typical Applications * **Embedded Systems:** Cooling small form-factor processors. * **Telecommunications:** Cooling ASICs in networking hardware. * **Power Electronics:** Managing heat for voltage regulators or MOSFETs. ---