The **ATS-04D-41-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Anodized Blue) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Fin Style** | Straight (Cross-cut) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 10.02°C/W @ 100 LFM (Linear Feet per Minute) | | **Pressure Method** | Compression Spring | --- ### 2. Detailed Component Breakdown #### A. The Heat Sink Body The main body is constructed from high-quality aluminum. It features a **cross-cut fin pattern**, which maximizes surface area for heat dissipation. This design is optimized for environments with moving air (forced convection) but can also function in natural convection scenarios. #### B. The Attachment Mechanism (Push-Pin) Unlike adhesive-based heat sinks, the `-R0` suffix indicates a mechanical attachment: * **Pins:** Brass pins that go through pre-drilled holes in the PCB. * **Springs:** Provide high-pressure contact between the heat sink and the electronic component (CPU, GPU, or ASIC) to ensure efficient heat transfer. #### C. Interface Material (TIM) The base of the ATS-04D-41-C2-R0 usually comes with **T766 Phase Change Material** or a similar thermal interface pre-applied. This fills the microscopic air gaps between the component and the metal base. --- ### 3. Part Number Decoder Understanding the naming convention helps in identifying the specific variant: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04D** | Series (Push-pin, 40mm width/length) | | **41** | Specific Height/Fin Configuration profile | | **C2** | Blue Anodized Finish / Specific Spring Tension | | **R0** | RoHS Compliant / Revision code | --- ### 4. Typical Applications This part is commonly found in industrial and consumer electronics where chips generate significant heat but the board is subject to vibration (making mechanical pins safer than glue). * **Networking:** Routers, Switches, and Gateways. * **Power Supplies:** Cooling MOSFETs or Voltage Regulators. * **Embedded Computing:** Single Board Computers (SBCs) or FPGA modules.