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  • ATS-04D-29-C2-R0

  • AI
    The **ATS-04D-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices like BGA (Ball Grid Array) chips, CPUs, or high-power transistors. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Heat Sink Type** | pushPIN™ HS Assembly | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Material** | Aluminum (Body), Copper (Thermal Interface) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.57°C/W (at 100 LFM) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 20mm | --- ### 2. Key Design Components #### A. pushPIN™ Attachment System The "R0" at the end of the part number indicates the use of a specific push-pin and spring mechanism. This design ensures: * **Constant Pressure:** The spring-loaded pins provide uniform pressure across the electronic component, ensuring optimal thermal contact. * **Tool-less Installation:** These are designed for quick assembly on printed circuit boards (PCBs) with pre-drilled holes. #### B. Fin Design This model utilizes **Straight Fin** or **Cross-Cut** geometry. The fins increase the surface area available for convective cooling. Because of its height (20mm) and fin density, it is categorized as a high-performance sink suitable for environments with moderate to high airflow. #### C. Thermal Interface Material (TIM) The part comes pre-applied with a thermal interface material (typically a high-performance phase-change material or grease). This fills microscopic air gaps between the heat source and the heat sink base to lower thermal resistance. --- ### 3. Part Number Breakdown Understanding the nomenclature helps in identifying the specific variant: * **ATS:** Advanced Thermal Solutions (Brand). * **04:** Series/Family type. * **D:** Attachment style (Push-pin variant). * **29:** Specific size/footprint code. * **C2:** Material/Finish code (Blue Anodized Aluminum). * **R0:** Packaging or revision indicator. --- ### 4. Applications This part is commonly used in the following electronic sectors: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Dissipating heat from large voltage regulators or FETs.
    ✨ Follow-up Questions
    • ⤷ What are the differences between blue anodized and black anodized heat sinks?
    • ⤷ How do I calculate if the 7.57°C/W thermal resistance is sufficient for my chip?
    • ⤷ What are the PCB hole requirements for the ATS push-pin mounting system?