ATS-04D-29-C2-R0
AI

The **ATS-04D-29-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic surface-mount devices like BGA (Ball Grid Array) chips, CPUs, or high-power transistors.
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### 1. Technical Specifications
Below are the primary physical and thermal characteristics of this specific part number:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Heat Sink Type** | pushPIN™ HS Assembly |
| **Attachment Method** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum (Body), Copper (Thermal Interface) |
| **Finish** | Blue Anodized |
| **Thermal Resistance** | 7.57°C/W (at 100 LFM) |
| **Dimensions (L x W)** | 45mm x 45mm |
| **Height** | 20mm |
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### 2. Key Design Components
#### A. pushPIN™ Attachment System
The "R0" at the end of the part number indicates the use of a specific push-pin and spring mechanism. This design ensures:
* **Constant Pressure:** The spring-loaded pins provide uniform pressure across the electronic component, ensuring optimal thermal contact.
* **Tool-less Installation:** These are designed for quick assembly on printed circuit boards (PCBs) with pre-drilled holes.
#### B. Fin Design
This model utilizes **Straight Fin** or **Cross-Cut** geometry. The fins increase the surface area available for convective cooling. Because of its height (20mm) and fin density, it is categorized as a high-performance sink suitable for environments with moderate to high airflow.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with a thermal interface material (typically a high-performance phase-change material or grease). This fills microscopic air gaps between the heat source and the heat sink base to lower thermal resistance.
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### 3. Part Number Breakdown
Understanding the nomenclature helps in identifying the specific variant:
* **ATS:** Advanced Thermal Solutions (Brand).
* **04:** Series/Family type.
* **D:** Attachment style (Push-pin variant).
* **29:** Specific size/footprint code.
* **C2:** Material/Finish code (Blue Anodized Aluminum).
* **R0:** Packaging or revision indicator.
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### 4. Applications
This part is commonly used in the following electronic sectors:
1. **Telecommunications:** Cooling of high-speed network switches and routers.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Dissipating heat from large voltage regulators or FETs.
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What are the differences between blue anodized and black anodized heat sinks?
- ⤷ How do I calculate if the 7.57°C/W thermal resistance is sufficient for my chip?
- ⤷ What are the PCB hole requirements for the ATS push-pin mounting system?