The **ATS-04D-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, designed specifically for thermal management in electronic systems. ### 1. Technical Specifications The following table outlines the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-04D-142-C2-R0 | | **Base Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 10.07° C/W @ 100 LFM | | **Fin Style** | Fine Pitch (straight fins) | --- ### 2. Key Design Components #### A. Thermal Interface Material (TIM) The "R0" suffix indicates that this part comes pre-applied with **Phase Change Material (PCM)** or a high-performance thermal pad. This ensures maximum heat transfer between the electronic component (CPU, FPGA, or MOSFET) and the aluminum base by filling microscopic air gaps. #### B. pushPIN™ Attachment Unlike adhesive tapes, this heat sink uses a mechanical **pushPIN™** system. * **Springs:** Provide consistent pressure (Force) to maintain optimal contact. * **Brass/Plastic Pins:** Secure the unit into pre-drilled holes on the PCB. #### C. Fin Geometry The "Fine Pitch" design is optimized for **forced air cooling** (active cooling with a fan). The spacing between the aluminum fins is calculated to maximize surface area while minimizing pressure drop as air flows through the sink. --- ### 3. Applications This part is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed signal processors. 2. **Embedded Systems:** Protecting compact SoCs (System on Chips). 3. **Power Electronics:** Dissipating heat from voltage regulators or motor drivers.