The **ATS-04D-101-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heat sink**. It is designed to cool electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part number: | Property | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 40mm x 40mm x 30mm | | **Attachment Method** | Push-Pin (Brass, 7-10mm pitch) | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | ~6.69 °C/W (Unducted Flow) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. The Heat Sink Body The main body is constructed from high-quality **Aluminum**. The **Blue Anodized finish** is not just for aesthetics; it provides surface protection and slightly increases emissivity to help with heat radiation. The 30mm height allows for a larger surface area, making it suitable for systems with moderate vertical clearance. #### B. The Push-Pin Mechanism Unlike adhesive-based heat sinks, the "04D" series uses a mechanical **Push-Pin** system: * **Stability:** Provides consistent pressure on the component (e.g., a BGA chip). * **Reliability:** Resistant to vibration and thermal expansion cycles that can cause adhesives to fail. * **Springs:** Usually includes a stainless steel or music wire spring to maintain precise downward force. #### C. Thermal Interface Material (TIM) The part number suffix indicates it comes with **T766** pre-applied to the base. * **Purpose:** Fills microscopic air gaps between the chip and the heat sink. * **Benefit:** Simplifies the assembly process in mass production and ensures optimal heat transfer immediately upon installation. --- ### 3. Application Use Cases The ATS-04D-101-C2-R0 is typically used in the following environments: * **Network Switches/Routers:** Cooling high-speed processing chips. * **Industrial PCs:** Where high-vibration resistance is required. * **Power Supplies:** Cooling voltage regulators or MOSFETs. ---