The **ATS-04D-06-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the *pushPIN™* series designed for precision cooling of integrated circuits (ICs). --- ### 1. Technical Specifications The following table highlights the primary physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 40mm x 40mm x 25mm | | **Fin Style** | Fine-Pitch (Straight) | | **Thermal Resistance (Unducted)** | 4.90 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 0.90 °C/W @ 100 LFM | --- ### 2. Design and Construction The "electronic parts" of this assembly consist of the mechanical structure and the interface materials used to dissipate heat: * **Heat Sink Body:** Constructed from high-grade aluminum. It uses a **square fin** pattern which maximizes surface area while allowing for multi-directional airflow. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766** phase-change material or high-performance thermal grease. This fills the microscopic air gaps between the CPU/GPU and the heat sink. * **Attachment Mechanism:** It utilizes a **pushPIN™** system. This consists of a plastic or brass pin and a stainless steel compression spring that provides consistent pressure (load) across the chip surface. --- ### 3. Nomenclature Breakdown The part number can be decoded as follows: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Series / Product Family | | **D** | Attachment Type (pushPIN™) | | **06** | Fin Configuration / Height Code | | **C2** | Thermal Interface Material (TIM) and Performance Grade | | **R0** | Revision / Packaging Code | --- ### 4. Application This part is commonly used in: 1. **Telecommunications:** Cooling of high-speed processors in routers or switches. 2. **Industrial PCs:** Maintaining stable temperatures for embedded controllers. 3. **Power Electronics:** Dissipating heat from MOSFETs or IGBT modules.