The **ATS-04D-01-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing the cooling element directly to a Printed Circuit Board (PCB). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 21.90°C/W (Natural) to 6.60°C/W (300 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | | **Fin Pattern** | Fine Pitch (straight fins) | --- ### 2. Key Electronic & Mechanical Parts #### A. The Heat Sink Body The main body is made of **Aluminum 6063**, which is the industry standard for thermal conductivity in passive cooling. The "Blue Anodized" coating is not just for aesthetics; it provides: * Increased surface emissivity for better radiation. * Protection against corrosion and environmental wear. * Electrical insulation (anodized layers are non-conductive). #### B. Push-Pin Fasteners Unlike adhesive-based heat sinks, this model uses **Brass Push-Pins** with steel springs. * **Purpose:** Provides consistent "Thermal Interface Material" (TIM) pressure. * **Safety:** The spring-loaded mechanism ensures the heat sink does not shift during vibration or mechanical shock. #### C. Thermal Interface Material (TIM) Usually, these parts come pre-applied with **ATS-PPS-01** or a similar Phase Change Material (PCM) or thermal grease on the base. This fills the microscopic air gaps between the electronic component (CPU/GPU/FPGA) and the heat sink. --- ### 3. Thermal Performance Profile The efficiency of this part depends heavily on the airflow (Linear Feet per Minute - LFM) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 21.90 | | **200 LFM** | 9.60 | | **400 LFM** | 5.20 | | **600 LFM** | 4.00 | --- ### 4. Typical Applications This specific part is sized for medium-sized electronic chips, commonly found in: * **Network Switches/Routers:** Cooling ASICs and processors. * **Industrial Power Supplies:** Dissipating heat from MOSFETs or IGBTs. * **Embedded Systems:** Protecting SoCs (System on Chip) from thermal throttling.