The **ATS-04B-76-C2-R0** is a specific electronic component primarily classified as a **High-Performance Heat Sink**. It is part of the "pushPIN™" series manufactured by **Advanced Thermal Solutions (ATS)**. Below is a detailed breakdown of its specifications, design, and technical features. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04B-76-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 11.50 °C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 15.00mm | | **Thermal Interface Material** | T766 (Pre-applied) | --- ## 2. Key Design Components ### A. Fin Pattern (Straight Fin) The "76" in the part number indicates a specific fin density and geometry. This model utilizes a **Straight Fin** design, which is ideal for systems where the airflow direction is consistent and predictable. ### B. Attachment Mechanism (pushPIN™) Instead of using adhesive tapes or simple clips, this part uses the pushPIN™ system: * **Spring-loaded:** Ensures even pressure across the surface of the electronic component (CPU, GPU, or MOSFET). * **Flexible Mounting:** Designed to fit specific hole patterns on a PCB to prevent the heat sink from shifting during vibration or shipping. ### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal resistance. --- ## 3. Performance Data (Airflow) Thermal performance varies based on the velocity of the air moving through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **100** | 11.50 | | **200** | 4.41 | | **300** | 2.96 | | **400** | 2.40 | | **500** | 2.10 | --- ## 4. Typical Applications This component is generally used to cool small-form-factor electronics, including: * **Microprocessors:** Smaller CPUs in embedded systems. * **Networking Gear:** Cooling chipsets in routers or switches. * **Power Supplies:** Managing heat for high-output transistors.