The **ATS-04B-75-C1-R0** is a specific high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient thermal management for electronic components such as processors, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Dimensions (L x W x H)** | 25.0 mm x 25.0 mm x 30.0 mm | | **Material** | Aluminum (Al) | | **Fin Type** | Straight Fin (provides high surface area) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Finish** | Blue Anodized | | **Thermal Resistance** | ~14.95 °C/W (at 100 LFM) | --- ### 2. Design and Component Breakdown #### A. Thermal Interface Material (TIM) * **Pre-applied:** This model typically comes with a pre-applied high-performance phase-change thermal interface material. * **Purpose:** It fills microscopic air gaps between the component (CPU/chip) and the heat sink base to maximize heat transfer efficiency. #### B. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, the `ATS-04B-75-C1-R0` uses a mechanical attachment system: * **Hardware:** It includes a brass or plastic push-pin with a stainless steel spring. * **Reliability:** This ensures consistent pressure across the surface of the chip, preventing "tilting" and improving long-term reliability in high-vibration environments. #### C. Fin Geometry * **Flow Pattern:** The straight fin design is optimized for unidirectional airflow. It is most effective when paired with a dedicated system fan that blows air directly through the fins. --- ### 3. Application Use Cases The ATS-04B-75-C1-R0 is commonly used in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Consumer Electronics:** Small Form Factor (SFF) devices requiring vertical heat dissipation. --- ### 4. Part Number Breakdown The nomenclature identifies specific traits: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **04:** Series/Type. * **B:** Material/Fin configuration. * **75:** Specific length/width profile. * **C1:** Thermal performance grade/Interface material. * **R0:** Revision/Packaging code.