The **ATS-04B-72-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Heat Sink Type** | Push-pin style (Cross-cut) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Attachment Method** | Push-Pin (Plastic) with Springs | | **Thermal Resistance** | 5.11 °C/W @ 200 LFM | | **Pressure Drop** | 0.15 in H2O @ 200 LFM | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Component Analysis #### A. The Heat Sink Body (Cross-Cut) The device features a **cross-cut fin design**. Unlike straight fins, cross-cut fins allow for multi-directional airflow. This is particularly useful in dense electronic enclosures where the direction of the system fan's airflow might not be perfectly aligned with the heat sink. #### B. Attachment Mechanism (Push-Pins & Springs) The "72" in the part number corresponds to a specific hardware kit. * **Push-Pins:** These provide a secure, tool-less installation into the PCB holes. * **Compression Springs:** These ensure constant, uniform pressure between the heat sink and the chip, which is critical for minimizing thermal contact resistance. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * **Function:** It fills microscopic air gaps between the chip surface and the heat sink base. * **Benefit:** This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a consistent layer thickness. --- ### 3. Part Number Breakdown The part number follows the ATS internal coding system: | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **04B** | Series/Product Family (Push-Pin Heat Sinks) | | **72** | Hardware Kit (Specific spring tension and pin length) | | **C2** | Thermal Performance Class / Material Grade | | **R0** | Revision/Finish Code (Standard Blue Anodized) | --- ### 4. Typical Applications * **BGA Cooling:** Primarily used for Ball Grid Array (BGA) components. * **Networking Gear:** Cooling processors in switches and routers. * **Embedded Systems:** Industrial PCs where high vibration requires a secure mechanical attachment (push-pins are more secure than tape-on sinks).