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  • ATS-04B-49-C2-R0

  • AI
    The **ATS-04B-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed for cooling electronic components like CPUs, GPUs, and other integrated circuits. ### 1. Technical Specifications The following table outlines the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 2.63°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Fin Style** | Fine Pitch (straight fins) | --- ### 2. Key Electronic Features #### A. Thermal Resistance Efficiency The core function of this part is to dissipate heat. The "C2" in the part number indicates a specific thermal performance profile. It reduces the junction temperature of a semiconductor, preventing thermal throttling or hardware failure. #### B. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. This provides: * **Constant Pressure:** Ensures a tight, uniform interface between the component and the heat sink. * **Reliability:** Resistant to vibration and shock compared to thermal tape. * **Ease of Assembly:** Features pre-drilled holes and a spring-loaded mechanism for quick installation. #### C. Material and Coating * **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity. * **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling. --- ### 3. Application Use Cases This specific model is typically used in space-constrained electronic environments: 1. **Telecommunications:** Cooling of high-speed networking chips. 2. **Embedded Systems:** Industrial PCs where airflow might be limited. 3. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators. ---
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this specific heat sink?
    • ⤷ What are the compatible spring types for the ATS pushPIN system?
    • ⤷ Are there copper versions of the ATS-04B series for better conductivity?