ATS-04B-49-C2-R0
AI

The **ATS-04B-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions Inc.* It is designed for cooling electronic components like CPUs, GPUs, and other integrated circuits.
### 1. Technical Specifications
The following table outlines the primary physical and thermal characteristics of the part:
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Thermal Resistance** | 2.63°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm |
| **Fin Style** | Fine Pitch (straight fins) |
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### 2. Key Electronic Features
#### A. Thermal Resistance Efficiency
The core function of this part is to dissipate heat. The "C2" in the part number indicates a specific thermal performance profile. It reduces the junction temperature of a semiconductor, preventing thermal throttling or hardware failure.
#### B. pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this model uses a mechanical push-pin system. This provides:
* **Constant Pressure:** Ensures a tight, uniform interface between the component and the heat sink.
* **Reliability:** Resistant to vibration and shock compared to thermal tape.
* **Ease of Assembly:** Features pre-drilled holes and a spring-loaded mechanism for quick installation.
#### C. Material and Coating
* **Aluminum Construction:** Offers a lightweight solution with high thermal conductivity.
* **Blue Anodized Finish:** Provides corrosion resistance and increases surface emissivity, which slightly improves radiative cooling.
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### 3. Application Use Cases
This specific model is typically used in space-constrained electronic environments:
1. **Telecommunications:** Cooling of high-speed networking chips.
2. **Embedded Systems:** Industrial PCs where airflow might be limited.
3. **Power Electronics:** Dissipating heat from MOSFETs or Voltage Regulators.
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- ⤷
How do I calculate the required airflow (LFM) for this specific heat sink?
- ⤷ What are the compatible spring types for the ATS pushPIN system?
- ⤷ Are there copper versions of the ATS-04B series for better conductivity?