The **ATS-04B-41-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** designed for cooling integrated circuits (ICs) and other electronic components using Advanced Thermal Solutions' (ATS) proprietary "maxiFLOW" technology. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Product Series** | maxiFLOW™ | | **Attachment Method** | pushPIN™ (Brass Springs/Plastic Pins) | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Thermal Resistance** | 10.02 °C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. maxiFLOW™ Design The "maxiFLOW" geometry features a spread fin structure. Unlike standard extruded heat sinks, these fins are tapered and angled to maximize surface area while reducing pressure drop, which is critical in high-density electronic enclosures. #### B. pushPIN™ Attachment System To ensure secure contact with the PCB and the electronic component (like a BGA or FPGA), this model uses a **pushPIN™ system**. - It provides a standardized hole pattern. - It includes a compression spring that ensures consistent "TIM" (Thermal Interface Material) pressure, preventing air gaps that cause overheating. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink base and the electronic chip, significantly lowering the contact resistance. --- ### 3. Applications This part is commonly found in the following electronic environments: * **Networking Hardware:** Routers, switches, and base stations. * **Industrial PCs:** High-heat processors in fanless or low-airflow environments. * **Power Supplies:** Cooling MOSFETs or power ICs.