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  • ATS-04B-182-C2-R0

  • AI
    The **ATS-04B-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed specifically to dissipate heat from electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Base Dimensions** | 40mm x 40mm | | **Height** | 15mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 7.51°C/W (at 100 LFM) | | **Thermal Interface** | T766 (Pre-applied Thermal Grease) | --- ### 2. Key Component Features #### A. The pushPIN™ Attachment System This part uses a specialized mechanical attachment system instead of adhesive tape. * **Hardware:** It consists of a brass or plastic pin with a stainless steel spring. * **Benefit:** Provides consistent pressure on the component, improving heat transfer and allowing for easy removal/rework without damaging the PCB. #### B. Heat Sink Geometry * **Straight Fin Design:** This model features vertical fins. It is optimized for **unidirectional airflow**, meaning it works best when the system fan blows air directly across the fins. * **Low Profile:** At only 15mm tall, it is designed for tight spaces like 1U servers or compact embedded systems. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **ATS-T766** thermal grease pre-applied to the base. This ensures maximum thermal conductivity between the electronic chip and the aluminum base by filling microscopic air gaps. --- ### 3. Comparison of Airflow Performance Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 7.51 | | 200 | 4.15 | | 300 | 3.28 | | 400 | 2.84 | | 500 | 2.55 | --- ### 4. Application Use Cases This part is typically found in: * **Networking Equipment:** Switches and routers. * **Industrial PCs:** Compact motherboards and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators.
    ✨ Follow-up Questions
    • ⤷ How do I calculate the correct hole diameter on the PCB for the pushPIN mounting?
    • ⤷ What is the difference between the C1 and C2 versions of this heat sink?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?