ATS-04B-182-C2-R0
AI

The **ATS-04B-182-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed specifically to dissipate heat from electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Base Dimensions** | 40mm x 40mm |
| **Height** | 15mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | 7.51°C/W (at 100 LFM) |
| **Thermal Interface** | T766 (Pre-applied Thermal Grease) |
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### 2. Key Component Features
#### A. The pushPIN™ Attachment System
This part uses a specialized mechanical attachment system instead of adhesive tape.
* **Hardware:** It consists of a brass or plastic pin with a stainless steel spring.
* **Benefit:** Provides consistent pressure on the component, improving heat transfer and allowing for easy removal/rework without damaging the PCB.
#### B. Heat Sink Geometry
* **Straight Fin Design:** This model features vertical fins. It is optimized for **unidirectional airflow**, meaning it works best when the system fan blows air directly across the fins.
* **Low Profile:** At only 15mm tall, it is designed for tight spaces like 1U servers or compact embedded systems.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates it comes with **ATS-T766** thermal grease pre-applied to the base. This ensures maximum thermal conductivity between the electronic chip and the aluminum base by filling microscopic air gaps.
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### 3. Comparison of Airflow Performance
Thermal resistance varies based on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM):
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 | 7.51 |
| 200 | 4.15 |
| 300 | 3.28 |
| 400 | 2.84 |
| 500 | 2.55 |
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### 4. Application Use Cases
This part is typically found in:
* **Networking Equipment:** Switches and routers.
* **Industrial PCs:** Compact motherboards and controllers.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
- ⤷
How do I calculate the correct hole diameter on the PCB for the pushPIN mounting?
- ⤷ What is the difference between the C1 and C2 versions of this heat sink?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?