The **ATS-04B-101-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** heat sink assembly series, designed specifically for thermal management in electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ### Technical Specifications Below are the primary mechanical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Thermal Resistance (Flow)** | 6.77 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.30 °C/W @ 400 LFM | | **Spring Type** | ATS-PPS-04 | --- ### Key Components & Design Features #### 1. Heat Sink Geometry * **Fin Pitch:** This model uses a **Fine-Pitch** design, which increases the surface area available for heat dissipation. * **Airflow optimization:** The layout is designed to work efficiently with forced air (fans) while maintaining low pressure drop. #### 2. Attachment Mechanism (pushPIN™) The "04" in the part number refers to the specific attachment kit. * **Spring-loaded bolts:** Ensures consistent pressure between the heat sink and the chip to maximize thermal transfer. * **Ease of Install:** Designed for quick assembly on PCBs with pre-drilled holes. #### 3. Thermal Interface Material (TIM) The **"C3"** designation in the part number typically refers to the thermal interface material: * **Pre-applied:** This model comes with a high-performance thermal grease or pad pre-applied to the base, reducing assembly time and ensuring a uniform bond. #### 4. Material and Finish * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodized:** The finish is not just aesthetic; anodizing increases surface emissivity and protects the aluminum from corrosion. --- ### Typical Applications * **Networking Gear:** Switches and routers where high-speed processing generates significant heat. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Cooling MOSFETs or power modules in space-constrained environments.