công cụ tìm kiếm bảng dữ liệu linh kiện điện tử
  Vietnamese  ▼
ALLDATASHEET.VN

X  

  • ATS-04A-101-C2-R0

  • AI
    The **ATS-04A-101-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "superGRIP" series, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications Below are the primary electronic and physical specifications for this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.69°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Attachment Method** | superGRIP Clip (Secure Mechanical) | | **Fin Style** | Straight Fin | --- ### 2. Key Electronic Features #### A. Thermal Management The primary electronic role of this part is **heat dissipation**. High-speed processors, FPGAs, and ASICs generate significant heat; this heat sink prevents thermal throttling or permanent damage by maintaining the junction temperature within safe limits. #### B. superGRIP Attachment Unlike adhesive tapes that can fail under high temperatures or vibration, the `ATS-04A-101-C2-R0` uses a mechanical clip system: * **No PCB Holes:** It attaches directly to the component, saving board space. * **Uniform Pressure:** Ensures a consistent interface between the chip and the heat sink, maximizing thermal conductivity. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it typically comes pre-applied with high-performance thermal tape or grease (often **Chomerics T766**), which fills microscopic air gaps between the chip and the metal surface. --- ### 3. Application Use Cases This specific model is commonly used in the following electronic environments: * **Telecommunications:** High-speed routers and switches. * **Power Supplies:** Cooling voltage regulators. * **Industrial PC:** Protecting CPUs in fanless or high-airflow enclosures. * **Embedded Systems:** Cooling SoC (System on Chip) components. --- ### 4. Part Number Breakdown Understanding the nomenclature helps in identifying its properties: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04A:** Series designation. * **101:** Specific dimensions and fin configuration. * **C2:** Thermal Interface Material (TIM) type. * **R0:** Revision code / Rohs Compliant.
    ✨ Follow-up Questions
    • ⤷ What is the airflow sensitivity (LFM) required for this heat sink to reach optimal performance?
    • ⤷ Can the superGRIP clip be reused if the component is replaced?
    • ⤷ How does blue anodizing affect the thermal emissivity compared to bare aluminum?