The **ATS-03H-101-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 45mm x 45mm x 30mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 6.69°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Profile (Straight Fin) The "H" in the part number indicates a specific fin density. This model features a **Straight Fin** design, which provides low pressure drop and is ideal for systems where the airflow direction is consistent. #### B. pushPIN™ Attachment Unlike adhesive tapes or simple clips, the `pushPIN™` system uses a flexible mounting mechanism: * **Compression Springs:** Ensures precise and consistent pressure on the component. * **Brass/Plastic Pins:** Provides a secure mechanical lock to the PCB. * **Reliability:** Highly resistant to shock and vibration compared to thermal tape. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material or high-conductivity grease designed to fill microscopic air gaps between the heat sink and the electronic chip, maximizing heat transfer. --- ### 3. Applications This part is commonly used in industrial and computing environments, including: * **Network Switches/Routers:** For cooling high-speed processors. * **Embedded Systems:** Industrial PCs requiring robust mechanical mounting. * **Power Electronics:** Cooling MOSFETs or IGBT modules.