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  • ATS-03F-85-C2-R0

  • AI
    The **ATS-03F-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of surface-mount components like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table highlights the critical physical and thermal properties of this part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35mm x 35mm x 10mm | | **Fin Style** | Fine Pitch (Cross-Cut) | | **Thermal Resistance** | 23.98 °C/W (Unducted @ 100 LFM) | | **TIM (Thermal Interface Material)** | T766 (Pre-applied) | --- ### 2. Key Components & Features #### A. The Heat Sink Body * **Fin Design:** It uses a cross-cut pattern which provides a high surface area. This is ideal for omnidirectional airflow, meaning it performs well regardless of which direction the air is blowing across the PCB. * **Low Profile:** With a height of only 10mm, it is designed for space-constrained applications (1U servers, mobile devices, or compact networking gear). #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a mechanical attachment system: * **Springs:** Provides consistent pressure (clamping force) on the electronic chip to ensure maximum heat transfer. * **Plastic Push Pins:** These lock into pre-drilled holes in the PCB for a secure, vibration-resistant fit. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied to the base. This fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance. --- ### 3. Applications This part is typically used in the following electronic environments: * **Telecommunications:** Cooling of high-speed signal processors. * **Computing:** Secondary chipsets or voltage regulator modules (VRMs). * **Industrial Power:** Managing heat in power transistors or motor controllers. --- ### 4. Part Number Breakdown ```text ATS - 03 - F - 85 - C2 - R0 | | | | | | | | | | | +-- Revision Code | | | | +------- Thermal Interface Material (T766) | | | +------------ Product Dimension/Series Identifier | | +---------------- Fin Pitch (Fine) | +--------------------- Push-pin type/Size +-------------------------- Advanced Thermal Solutions (Manufacturer) ```
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required PCB hole size for the pushPIN attachment?
    • ⤷ What is the difference between T766 and other thermal interface materials?
    • ⤷ Is there a version of this heat sink with a higher profile for better cooling?