AI

The **ATS-03F-85-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of surface-mount components like CPUs, GPUs, or FPGAs.
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### 1. Technical Specifications
The following table highlights the critical physical and thermal properties of this part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions** | 35mm x 35mm x 10mm |
| **Fin Style** | Fine Pitch (Cross-Cut) |
| **Thermal Resistance** | 23.98 °C/W (Unducted @ 100 LFM) |
| **TIM (Thermal Interface Material)** | T766 (Pre-applied) |
---
### 2. Key Components & Features
#### A. The Heat Sink Body
* **Fin Design:** It uses a cross-cut pattern which provides a high surface area. This is ideal for omnidirectional airflow, meaning it performs well regardless of which direction the air is blowing across the PCB.
* **Low Profile:** With a height of only 10mm, it is designed for space-constrained applications (1U servers, mobile devices, or compact networking gear).
#### B. The pushPIN™ Attachment System
Instead of using messy adhesives or permanent solder, this part uses a mechanical attachment system:
* **Springs:** Provides consistent pressure (clamping force) on the electronic chip to ensure maximum heat transfer.
* **Plastic Push Pins:** These lock into pre-drilled holes in the PCB for a secure, vibration-resistant fit.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates it comes with **T766 thermal grease** pre-applied to the base. This fills the microscopic air gaps between the chip and the heat sink, significantly reducing thermal resistance.
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### 3. Applications
This part is typically used in the following electronic environments:
* **Telecommunications:** Cooling of high-speed signal processors.
* **Computing:** Secondary chipsets or voltage regulator modules (VRMs).
* **Industrial Power:** Managing heat in power transistors or motor controllers.
---
### 4. Part Number Breakdown
```text
ATS - 03 - F - 85 - C2 - R0
| | | | | |
| | | | | +-- Revision Code
| | | | +------- Thermal Interface Material (T766)
| | | +------------ Product Dimension/Series Identifier
| | +---------------- Fin Pitch (Fine)
| +--------------------- Push-pin type/Size
+-------------------------- Advanced Thermal Solutions (Manufacturer)
```
- ⤷
How do I calculate the required PCB hole size for the pushPIN attachment?
- ⤷ What is the difference between T766 and other thermal interface materials?
- ⤷ Is there a version of this heat sink with a higher profile for better cooling?