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  • ATS-03F-75-C3-R0

  • AI
    The **ATS-03F-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary technical parameters of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 15.29°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Electronic Features ### A. Push-Pin Attachment Mechanism This part uses a **push-pin and spring** assembly rather than adhesive tape or screws. * **Benefit:** It provides a precise, consistent pressure across the surface of the component. * **Serviceability:** It allows for easy installation and removal without damaging the Printed Circuit Board (PCB). ### B. High-Efficiency Fin Profile The heat sink utilizes a straight-fin design optimized for airflow. * **Airflow direction:** It works best in systems with defined airflow (forced convection), such as those with cooling fans. * **Aspect Ratio:** The fins are designed to maximize surface area within a small 25mm footprint. ### C. Integrated Thermal Interface Material (TIM) The part comes pre-applied with **T412**. * **Role:** It fills microscopic air gaps between the heat sink base and the electronic component. * **Efficiency:** Eliminates the need for manual thermal paste application, ensuring uniform thermal conductivity. --- ### 3. Applications The ATS-03F-75-C3-R0 is typically found in: 1. **Embedded Systems:** Industrial PCs where space is limited. 2. **Telecommunications:** Network switches and routers. 3. **Power Electronics:** Voltage regulators and high-speed motor drivers. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between push-pin and adhesive-backed heat sinks?
    • ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
    • ⤷ Can this heat sink be used on a component larger than 25x25mm?