ATS-03F-75-C3-R0
AI

The **ATS-03F-75-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
Below are the primary technical parameters of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (with Blue Anodized Finish) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 15.29°C/W (at 100 LFM) |
| **Dimensions (L x W x H)** | 25.00mm x 25.00mm x 30.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T412 (Pre-applied) |
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### 2. Key Electronic Features
### A. Push-Pin Attachment Mechanism
This part uses a **push-pin and spring** assembly rather than adhesive tape or screws.
* **Benefit:** It provides a precise, consistent pressure across the surface of the component.
* **Serviceability:** It allows for easy installation and removal without damaging the Printed Circuit Board (PCB).
### B. High-Efficiency Fin Profile
The heat sink utilizes a straight-fin design optimized for airflow.
* **Airflow direction:** It works best in systems with defined airflow (forced convection), such as those with cooling fans.
* **Aspect Ratio:** The fins are designed to maximize surface area within a small 25mm footprint.
### C. Integrated Thermal Interface Material (TIM)
The part comes pre-applied with **T412**.
* **Role:** It fills microscopic air gaps between the heat sink base and the electronic component.
* **Efficiency:** Eliminates the need for manual thermal paste application, ensuring uniform thermal conductivity.
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### 3. Applications
The ATS-03F-75-C3-R0 is typically found in:
1. **Embedded Systems:** Industrial PCs where space is limited.
2. **Telecommunications:** Network switches and routers.
3. **Power Electronics:** Voltage regulators and high-speed motor drivers.
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- ⤷
What is the difference between push-pin and adhesive-backed heat sinks?
- ⤷ How does 'LFM' (Linear Feet per Minute) affect the thermal resistance of this part?
- ⤷ Can this heat sink be used on a component larger than 25x25mm?