The **ATS-03F-70-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The part is defined by its material properties, dimensions, and thermal resistance capabilities. | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Dimensions (L x W)** | 45mm x 45mm | | **Height** | 25mm | | **Pitch** | Fine Pitch | | **Fin Pattern** | Straight Fin | | **Thermal Resistance** | 8.70°C/W (at 100 LFM) to 1.50°C/W (at 700 LFM) | --- ### 2. Key Components & Design Features #### A. The Fin Design * **Straight Fin Geometry:** This model uses vertical straight fins. This design is optimized for **forced air cooling** (where a fan is used). * **Fine Pitch:** The "F" in the part number indicates a fine pitch, meaning the fins are spaced closely together to maximize surface area for heat dissipation within a small footprint. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile plastic clips, this part uses a mechanical system consisting of: * **Brass Bolts:** High-durability pins that pass through the PCB. * **Stainless Steel Springs:** Provide precise "firm" pressure (compression) against the chip to ensure maximum thermal transfer. #### C. Thermal Interface Material (TIM) The "R0" suffix usually denotes that the part comes with **T766** pre-applied thermal phase-change material or a high-performance thermal pad, ensuring no air gaps exist between the heat sink and the electronic component. --- ### 3. Electronic Performance Summary The thermal resistance of this part varies significantly based on the airflow (measured in Linear Feet per Minute - LFM). | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 8.70 | | 300 (1.5 m/s) | 2.80 | | 500 (2.5 m/s) | 1.90 | | 700 (3.5 m/s) | 1.50 | --- ### 4. Typical Applications * **Networking Equipment:** Switches and routers where high-speed processors generate significant heat. * **Industrial Power Supplies:** Cooling power transistors and MOSFETs. * **Embedded Computing:** Compact motherboards where space for a cooling solution is limited but thermal loads are high. ---