The **ATS-03F-53-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push-pin (Brass) | | **Thermal Resistance** | 8.57°C/W (at 100 LFM) to 1.35°C/W (at 700 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 30.00mm | | **Pattern** | Cross-Cut (Square Fin) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. The Fin Design (Cross-Cut) The "53" in the part number refers to a specific fin configuration. The **cross-cut** design allows for multidirectional airflow. Unlike straight-fin heat sinks that require air to move in one specific direction, this part maintains high efficiency even if the cooling fan is offset or if the internal case airflow is turbulent. #### B. Attachment Mechanism (pushPIN™) The part uses a specialized push-pin system rather than adhesive or simple clips. - **Spring-loaded:** Ensures constant pressure on the chip, maximizing heat transfer. - **Secure:** Prevents the heat sink from shifting during shipping or vibration. - **Hardware:** Usually features a brass pin with a stainless steel spring. #### C. Thermal Interface Material (TIM) The **-C2** suffix indicates that it comes with **T766 phase-change material** pre-applied to the base. This eliminates the need for manual thermal paste application and ensures a bubble-free connection between the component and the heat sink. --- ### 3. Application Use Cases This part is typically found in: * **Telecommunications:** High-speed routers and switches. * **Embedded Systems:** Industrial motherboards. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Automotive:** Electronic Control Units (ECUs). ---