The **ATS-03F-50-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Part Number** | ATS-03F-50-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Flow Orientation** | Vertical/Horizontal (Cross-cut) | | **Thermal Resistance** | 19.03°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | --- ## Key Components & Features ### 1. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a **push-pin and spring mechanism**. This ensures: * **Constant Pressure:** Provides a firm, even contact between the heat sink and the component (TIM interface). * **Secure Mounting:** The pins lock into pre-drilled holes on the PCB, making it resistant to shock and vibration. ### 2. Cross-Cut Fin Design The "F" in the series often denotes a specific fin geometry. The fins are cut in a way that allows air to enter from multiple directions. This makes it ideal for systems where the airflow direction might be inconsistent or obstructed. ### 3. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased surface emissivity (improving radiation heat transfer) and protects the aluminum from corrosion. --- ## Performance Metrics Thermal performance is measured by **Thermal Resistance (°C/W)**. A lower value indicates better cooling. | Air Velocity (LFM) | Thermal Resistance (Unducted) | | :--- | :--- | | 100 (0.5 m/s) | 19.03 °C/W | | 300 (1.5 m/s) | 6.23 °C/W | | 500 (2.5 m/s) | 4.35 °C/W | --- ## Component Integration To use this part effectively in an electronic assembly, you must consider: 1. **PCB Layout:** The board must have the specific hole pattern required for the pushPIN™ spacing. 2. **Thermal Interface Material (TIM):** This heat sink usually comes with a pre-applied high-performance thermal interface (like ATS-54) to fill microscopic air gaps between the component and the heat sink. 3. **Clearance:** The 15mm height must fit within the enclosure or chassis profile.