The **ATS-03F-36-C2-R0** is a specific part number for a high-performance **Heatsink** manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push-pin" series designed for cooling electronic components like CPUs, GPUs, or high-power ICs. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 14.82 °C/W (at 100 LFM) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heatsink fits within the PCBA (Printed Circuit Board Assembly) layout. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 36.83 mm x 36.83 mm | | **Height** | 15.00 mm | | **Pin Distance** | 43.00 mm | --- ### 3. Component Breakdown #### A. The Heatsink Body Made from **6063 Aluminum**, the straight-fin design is optimized for forced-air cooling environments. The **Blue Anodized** coating is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly improves radiant heat transfer. #### B. Push-Pin & Spring Mechanism Unlike adhesive-based heatsinks, this part uses two plastic push-pins and springs. * **Benefits:** Provides consistent pressure on the chip, ensuring better contact with the TIM. * **Requirement:** The PCB must have pre-drilled holes to accept the push-pins. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a "Phase Change Material" that fills the microscopic air gaps between the component and the heatsink base once the operating temperature rises, significantly lowering thermal impedance. --- ### 4. Thermal Performance Comparison Thermal resistance ($R_{th}$) determines how effectively the part moves heat away from the silicon. * **Low Airflow (100 LFM):** ~14.82 °C/W * **Medium Airflow (300 LFM):** ~5.90 °C/W * **High Airflow (500 LFM):** ~4.40 °C/W *Note: Lower numbers represent better cooling efficiency.*