The **ATS-03F-34-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself contains encoded information about its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (typically AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimension (Length/Width)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 6.73°C/W (at 1.0 m/s airflow) | --- ### 2. Key Electronic Features #### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses a mechanical **pushPIN™** system. This provides: * **Constant Pressure:** Ensures optimal contact with the electronic component for maximum heat transfer. * **Vibration Resistance:** Securely locks the heat sink to the PCB, making it suitable for automotive or industrial environments. * **Reusability:** Allows for easy removal and re-application during maintenance. #### B. Thermal Interface Material (TIM) The "C2" suffix typically indicates that the part comes pre-applied with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste, ensuring a uniform and high-conductivity layer between the chip and the aluminum base. #### C. Straight Fin Design The straight fin geometry is optimized for **forced convection** (active cooling with a fan). The gaps between the fins allow air to flow through efficiently, removing heat from the large surface area of the aluminum structure. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Mid-Range" thermal solution, commonly used for: 1. **Network Switches/Routers:** Cooling ASICs and processors. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Supplies:** Cooling voltage regulators (VRMs) that generate significant heat under load. ---