ATS-03F-152-C2-R0
AI

The **ATS-03F-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat integrated circuits.
---
## 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Heat Sink Type** | Push Pin |
| **Fin Style** | Straight (Rectangular) |
| **Overall Dimensions** | 35mm x 35mm x 25mm |
| **Push Pin Material** | Brass |
| **Spring Type** | Compression Spring |
| **Thermal Interface (TIM)** | T766 (High Performance) |
---
## 2. Thermal Resistance Profile
Thermal performance is measured by how effectively the heat sink resists the flow of heat from the component to the ambient air. Lower values indicate better performance.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| **200 (1.0 m/s)** | 3.32 |
| **400 (2.0 m/s)** | 2.11 |
| **600 (3.0 m/s)** | 1.81 |
| **800 (4.0 m/s)** | 1.64 |
---
## 3. Key Electronic/Mechanical Features
### A. Push Pin Attachment
The **"03F"** in the part number denotes a specific push pin and spring assembly. This mechanism provides:
* **Constant Pressure:** Ensures uniform contact between the heat sink base and the electronic component.
* **Secure Mounting:** Prevents the heat sink from shifting due to mechanical shock or vibration.
### B. Thermal Interface Material (TIM)
The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the chip, significantly improving heat transfer efficiency.
### C. Material and Coating
* **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties.
* **Blue Anodizing:** This is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly aids in radiation cooling.
---
## 4. Part Number Breakdown
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **03** | Attachment Type (Push Pin Series) |
| **152** | Dimensions/Configuration Code |
| **C2** | Thermal Performance Level / Material Grade |
| **R0** | RoHS Compliant (Lead-free) |
- ⤷
How do I calculate the required airflow (LFM) for this heat sink?
- ⤷ What are the PCB hole diameter requirements for the brass push pins?
- ⤷ Can the pre-applied T766 thermal interface be replaced with different grease?