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  • ATS-03F-152-C2-R0

  • AI
    The **ATS-03F-152-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for efficient thermal management of electronic components like CPUs, GPUs, and other high-heat integrated circuits. --- ## 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Heat Sink Type** | Push Pin | | **Fin Style** | Straight (Rectangular) | | **Overall Dimensions** | 35mm x 35mm x 25mm | | **Push Pin Material** | Brass | | **Spring Type** | Compression Spring | | **Thermal Interface (TIM)** | T766 (High Performance) | --- ## 2. Thermal Resistance Profile Thermal performance is measured by how effectively the heat sink resists the flow of heat from the component to the ambient air. Lower values indicate better performance. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 3.32 | | **400 (2.0 m/s)** | 2.11 | | **600 (3.0 m/s)** | 1.81 | | **800 (4.0 m/s)** | 1.64 | --- ## 3. Key Electronic/Mechanical Features ### A. Push Pin Attachment The **"03F"** in the part number denotes a specific push pin and spring assembly. This mechanism provides: * **Constant Pressure:** Ensures uniform contact between the heat sink base and the electronic component. * **Secure Mounting:** Prevents the heat sink from shifting due to mechanical shock or vibration. ### B. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. In electronics, the TIM is crucial because it fills microscopic air gaps between the heat sink and the chip, significantly improving heat transfer efficiency. ### C. Material and Coating * **Aluminum 6063:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodizing:** This is not just for aesthetics; it provides corrosion resistance and increases surface emissivity, which slightly aids in radiation cooling. --- ## 4. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **03** | Attachment Type (Push Pin Series) | | **152** | Dimensions/Configuration Code | | **C2** | Thermal Performance Level / Material Grade | | **R0** | RoHS Compliant (Lead-free) |
    ✨ Follow-up Questions
    • ⤷ How do I calculate the required airflow (LFM) for this heat sink?
    • ⤷ What are the PCB hole diameter requirements for the brass push pins?
    • ⤷ Can the pre-applied T766 thermal interface be replaced with different grease?