The **ATS-03F-142-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series, designed for cooling electronic components such as CPUs, GPUs, or high-power semiconductors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Thermal Resistance** | 10.07°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | | **Weight** | ~12 grams | --- ### 2. Core Components & Design Elements #### A. Heat Sink Body (The Fin Array) * **Material:** Extruded aluminum, which provides a good balance between weight, cost, and thermal conductivity. * **Fin Style:** Straight fin design optimized for airflow through the device. * **Anodization:** The blue anodized coating is not just for aesthetics; it increases surface emissivity (improving radiation heat transfer) and protects the aluminum from corrosion. #### B. Attachment Mechanism (Push-Pins) * **Hardware:** It utilizes plastic or brass push-pins with stainless steel springs. * **Purpose:** The springs provide consistent pressure against the electronic chip, ensuring the best possible contact and heat transfer. * **Mounting Holes:** Requires a specific hole pattern on the PCB (Printed Circuit Board). #### C. Thermal Interface Material (TIM) * **T766:** The unit comes with a pre-applied phase-change material or thermal grease. This fills the microscopic air gaps between the chip and the heat sink base, significantly reducing thermal resistance. --- ### 3. Thermal Performance Profile Thermal resistance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 10.07 | | 400 (2.0 m/s) | 5.40 | | 600 (3.0 m/s) | 4.06 | | 800 (4.0 m/s) | 3.44 | --- ### 4. Application Use Cases * **BGA Cooling:** Ideal for Ball Grid Array (BGA) components used in networking and telecommunications. * **Embedded Systems:** Used in compact industrial PCs where vertical space is limited (15mm height). * **Power Supplies:** Cooling voltage regulators or power transistors that generate localized heat.