The **ATS-03F-13-C2-R0** is a specific electronic cooling component, categorized as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" family of thermal management solutions. --- ## 1. Technical Specifications The part number itself contains encoded information regarding its dimensions, material, and thermal performance. | Specification | Value/Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 15.00mm | | **Thermal Resistance** | 13.70 °C/W (Unducted @ 100 LFM) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Attachment Type** | Plastic Push Pin | | **Spring Type** | Brass (Standard) | --- ## 2. Key Features The ATS-03F-13-C2-R0 is designed for high-density electronic packaging where vertical space is limited but surface area is required for heat dissipation. * **Fine Pitch Fin Design:** The "F" in the series name denotes a fine-pitch fin pattern, which provides more surface area for heat transfer in forced-air environments. * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that applies uniform pressure across the component (CPU, GPU, or FPGA), ensuring optimal thermal interface material (TIM) performance. * **Pre-drilled Holes:** Designed to fit industry-standard hole patterns (in this case, typically a 43mm x 43mm spacing) on a Printed Circuit Board (PCB). * **Pre-Applied Thermal Interface:** These units often come with a high-performance thermal pad or phase-change material already applied to the base. --- ## 3. Physical Layout The heat sink utilizes a **cross-cut** or **pin-fin** architecture rather than simple straight fins. This allows for: 1. **Omni-directional Airflow:** Air can enter from any side, making it ideal for systems with complex internal air currents. 2. **Turbulence Generation:** The design breaks up laminar boundary layers, increasing the efficiency of the heat transfer to the air. --- ## 4. Part Number Breakdown The nomenclature follows this logic: * **ATS:** Advanced Thermal Solutions * **03:** Product Series * **F:** Fine Pitch * **13:** Specific model/height configuration * **C2:** Material/Finish Code (Aluminum, Blue Anodized) * **R0:** Revision code